Description
The High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm) as well as surface activation and modification.
Features: - Large, tabletop unit
- Adjustable RF power (Low, Medium, and High power settings)
- Applies a maximum of 45W to the RF coil
- Low RF power setting is equivalent to High RF power setting on PDC-001/PDC-002
- Includes a 6" diameter x 6.5" length Pyrex chamber
- Hinged door with viewing window
- Active fan cooling
- Integral switch for a vacuum pump
- 1/8" NPT metering valve to qualitatively control gas flow and chamber pressure
- 1/8" NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting
- Only requires a vacuum pump with a minimum pump speed of 1.4 m3/hr (0.83 ft3/min) and an ultimate total pressure of 200 mTorr (0.27 mbar) or less